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Fixing Adhesive - List of Manufacturers, Suppliers, Companies and Products

Fixing Adhesive Product List

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Chip component fixing adhesive Seal-glo NE series

Chip component fixing adhesive Seal-glo NE series

A heating-curable epoxy adhesive that is a one-component product and has excellent storage stability. It cures quickly in a short time of 1 to 2 minutes at temperatures between 90 and 150°C.

The "Seal-glo NE series adhesive for fixing chip components" is an adhesive developed for temporarily fixing chip components. It is a one-component, heat-curing epoxy adhesive that boasts excellent storage stability. Not only does it have rapid curing properties, curing in just 1 to 2 minutes at temperatures between 90 and 150°C, which is required for SMD mounting, but it also comes in various grades that excel in high-speed dispensing and fine printing to meet your needs. Halogen-free options are also available. For more details, please download the catalog or contact us.

  • glue

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Chip component fixing adhesive Seal-glo

Chip component fixing adhesive Seal-glo

Numerous application results with 1005CR! 'Seal-glo Chip Adhesive'. Compatible with high-speed dispensers and fine coating regardless of printing!

The Seal-glo NE series adhesive for temporarily fixing chip components can cure in a short time of 90 seconds at 90°C, minimizing the burden on the components. We offer various grades that excel in high-speed dispensing and fine printing to meet your needs. ■ Features - No issues with applying 1005CR bond (dispensing/printing) - Proven application of 0603CR bond (dispensing) - Confirmed ability to dispense with a nozzle inner diameter of Φ0.075mm - Achieves low-temperature curing at 90°C/90 seconds - Stable application shape with moderate peak height due to thixotropy - High adhesive strength, excellent storage stability, and moisture resistance - Extensive export experience both domestically and internationally - Resin mask contracting is also possible ■ Curing Conditions ○ Recommended curing conditions vary by series. Since curing temperatures differ depending on dispensing or printing, please contact us for details. ○ Depending on the size and arrangement of the components mounted on the substrate, the actual temperature applied to the adhesive may vary, so please seek the optimal curing conditions. For more details, please download the PDF or contact us.

  • Circuit board processing machine
  • glue

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Clear Prest: A temporary adhesive substitute for pine resin, wax, and adhesive tape.

Clear Prest: A temporary adhesive substitute for pine resin, wax, and adhesive tape.

It is ideal for precision parts processing that takes into account environmental protection and safety. While having strong adhesion, it achieves ultra-short peeling time.

【Features】 K Series For precision parts processing - Exhibits ultra-low viscosity and excellent wettability, allowing for precise work on the μm order. - Bonds strongly with a thin film, effective in preventing processing scratches and chipping on coated surfaces. - Can be removed by immersion in hot water or ethanol solution. CP Series For large parts processing - Has adhesive strength greater than wax, making it suitable for temporary fixing in various processes. - Can be peeled off in minutes by immersion in hot water, significantly reducing work time. - The temporary layer separates and peels off in a film form, making post-processing easy. *For more details, please contact us.

  • Glass

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